Diamond Wire is a special high strength steel wire with single layer diamond abrasive fixed on its surface.
It had strong capability for cutting large size, super hard and brittle crystalline materials, such as monocrystalline/polycrystalline silicon, silicon carbide, sapphire, crystal and other precious crystals. Compared with free diamond saw cutting wire. Wire saw cutting has the advantages of lower overall processing costs, improvement of processing quality and reduction of environmental influence etc.
Diamond wire is mainly used in the field of monocrystalline silicon, polysrystalline silicon cutting and slicing; cutting of sapphire ingots in the field of LED; cutting of magnetic materials such as neodymium magnets; cutting of hard and brittle materials such as silicon carbide, ceramics, etc.
Parameters：
NO.
Size
Core Wire（mm）
Emery Granularity（μm）
Diamete range（mm）
Broken Puling Force（N）
1
0.35
0.25
40-50
0.330-0.360
≧160
2
0.37
0.28
40-50
0.350-0.390
≧180
3
0.39
0.3
40-50
0.370-0.410
≧210
4
0.42
0.35
40-50
0.420-0.460
≧270
Our Services：
1.OEM Service is available .
2.Fast producing time.(7-15 days).
3.Reply promptly in 24 hours.
4.Free Sample available.
https://www.baonengwire.com/diamond-wire-for-semiconductor-material-cutting/