FR4 board guide
The characteristics of FR4 or FR-4 make it versatile and affordable. This is why it is widely used in the production of printed circuits. FR4 tg130 is the most commonly used material for fr4 circuit boards. FR4 describes a type of flame-retardant glass fiber epoxy laminate.
Why use FR4 on FR4 board?
The reasonable price of FR4 makes it the standard choice for small batch PCB production or electronic prototype production.
However, FR4 is not ideal for high-frequency printed circuits. Similarly, if you want to make PCBs into components that are not easy to use and are hardly suitable for flexible PCB products, you should choose another material: polyimide/polyamide.
Example of FR4 in fr4 board
Standard FR4: As the name suggests, this is the standard FR-4, and its heat resistance is about 140°C to 150°C.
High Tg FR4: This FR-4 has a high glass transition temperature (TG) of about 180°C.
High CTI FR4: The comparative tracking index is higher than 600 v.
FR4 without copper laminate: very suitable for insulation and board support.
The characteristics of these different materials will be described in detail later in this article.
What is fr4 circuit board material?
We have all heard that when we buy PCB chip factories, the abbreviation FR4 will be thrown away, but what does this actually mean? What is the effect of choosing PCB materials? This article will help eliminate fog and introduce some popular hard PCB materials.
You have most likely considered FR4 as a standard option for small batches or prototype PCBs, for example in visible fusion. FR-4 is the code for the refractory grade, which means that the resin material must be able to extinguish itself after burning. It is not the name of the material, but the grade of the material. For example, it has many subgroups of tgs-130.
The FR4 option on the PCB order page is the grade name of epoxy glass fiber, which usually forms the PCB core and prepreg layer. It is this basic characteristic that provides PCBs with the electrical insulation and mechanical strength required to withstand increasingly demanding applications. In a typical PCB, the core wire provides the rigidity and foundation of the printable PCB trace. In addition, the FR4 core and the laminate form an electrically insulating layer to separate the copper layer.
For a two-layer board, the FR4 core separates the top and bottom copper layers, while for a multi-layer PCB, an additional FR4 prepreg layer is sandwiched between the inner core and the outer copper layer. The desired final PCB thickness can be controlled by mixing different laminate thicknesses. This arrangement is called stacking. For example, a typical 4-layer board with a thickness of 1.6 mm may have a core of 1.2 mm. Two pieces of 0.12 mm prepreg, covered with copper, solder mask and silk screen, occupy about 1.6 mm. To make a 1.2 mm board, replace the core with a 0.8 mm thick core.
The core is actually composed of a copper-clad substrate, so it is also called a copper-clad laminate. The specified core thickness usually does not include copper. In order to fit