Electromechanical Assembly

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asked Jul 21, 2020 in Electron Microscopy by webdesignplus69 (18,800 points)

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Most common two part electrically conductive epoxies are used for component attachment, termination and other applications in hybrid circuits, membrane keypads and other electromechanical assemblies.

The thixotropic properties and non-stringing characteristics make them ideal materials for high-speed, dot dispense processes where low HELTRONICS temperature curing is required. They allow automated dot dispense processes to run up to 70% faster. This is attributed to their low viscosity and non-stringing characteristics.

They exhibit very good adhesion to most metal and plastic substrates, have good temperature resistance, toughness, and allow for differences in coefficients of thermal expansion between two bonded substrates.

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