Advantages:
1. Strong Engineering Capability on PCB, Components, SMT, PCB Design
2. Capable to offer you solution on Components Replacement and cost down
3. IC Programming and functional Testing, making testing fixture in-house.
4. Good for SSOP, TSOP, QFP, TQFP, PBGA Packaging components and so on
5. Excellent gold line (bonding) associativity
Electric screwdriver, as one of the most popular electric tools, its application is not limited industrial applications, but also to domestic area now. Using Consons's driver board, the electric screw driver can be efficient in power and low in EMI effects.
Design service:
● FPGA integration reduces design cycles, improving performance and manufacturing
● Constraint editor manages electrical and physical requirements
● Complete design creation and definition with schematics and HDL
● Full integration with layout environment
Product Specification:
Base Material: FR4
Board Thickness: 1.6mm
Copper Thickness: 1oz
Min. Hole Size: 0.25mm
Min. Line Width: 0.075mm
Min. Line Spacing: 0.075mm
Surface finishing: Green
Solder mask: Blue
Silkscreen: White
Certificates: ISO9001:2015, UL, CE, ROHS
FAQ:
1. What is a microvia hole?
According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land.
2. What is meant by a blind via hole?
It is a hole that runs from an outer layer to the inner layer, but not through the entire PCB. These holes can be drilled mechanically or using laser technology.The image in point 1 shows a laser drilled blind via.
3. What is meant by a buried via hole?
This is a hole that runs between one or more inner layers. They are normally mechanically drilled.
4. What is a HDI PCB?
IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces ≤ 100 µm / 0.10mm, smaller vias (<150 µm) and capture pads <400 µm / 0.40mm, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology.
5. Are there different types of HDI features?
The graphic below shows the main structures – type I, type II and type III as defined in IPC-2226.
Type I. Defines a single microvia layer on either one or both sides of core. Uses both plated microvia and PTH for interconnection, employing blind, but not buried vias.
Type II. Defines a single microvia layer on either one or both sides of core. Uses both plated microvia and PTH for interconnection. Employs blind and buried vias.
Type III. Defines at least two layers of microvia on either one or both sides of core. Uses both plated microvia and PTH for interconnection. Employs blind and buried vias.
Construction terminology to define the degree of HDI construction:
1+n+1 = single layer of microvia (as per the type I and type II examples above)
2+n+2 = 2 layers of microvia (as per the type III example above)
3+n+3 = 3 layers of microvia PCBA Assembly factory
website:http://www.abcpcba.com/pcba-assembly/ |